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May 05, 2024

Pixus Offers New Dual Depth SpaceVPX Development Chassis for 3U Boards

Waterloo, Ontario — Aug 24, 2023 – Pixus Technologies, a provider of embedded computing and enclosure solutions, now offers an OpenVPX chassis platform that supports both 160mm deep and 220mm deep

Waterloo, Ontario — Aug 24, 2023 – Pixus Technologies, a provider of embedded computing and enclosure solutions, now offers an OpenVPX chassis platform that supports both 160mm deep and 220mm deep SpaceVPX™ and OpenVPX 3U boards.

The open frame chassis features up to four slots at 1.0” pitch of each board depth. The modular enclosure has card guide options to support both air-cooled boards and conduction-cooled boards. There are also 220mm deep card guides that are wider to support extra thick SpaceVPX conduction-cooled boards per VITA 78.

A wide range of 3U or 6U OpenVPX backplanes are available, including versions that utilize the KVPX connector per VITA 63. A modular fixed PSU or a pluggable VITA 62 PSU slot is available in multiple configurations.

Pixus offers SOSA™ aligned, OpenVPX, SpaceVPX, and other architecture backplanes and enclosure systems. The company provides enclosure solutions in 19” rackmount, ATR/Rugged, development, and specialty small form factor designs.

About Pixus Technologies

Leveraging over 20 years of innovative standard products, the Pixus team is comprised of industry experts in electronics packaging. Founded in 2009 by senior management from Kaparel Corporation, a Rittal company, Pixus Technologies’ embedded backplanes and systems are focused primarily on ATCA, OpenVPX, MicroTCA, and custom designs. Pixus also has an extensive offering of VME-based and cPCI-based solutions. In May 2011, Pixus Technologies became the sole authorized North and South American supplier of the electronic packaging products previously offered by Kaparel Corporation and Rittal.